Posts Tagged: nanostructures
P2N group in FP7 NANOTEC project and download “Recommendations on Beyond CMOS Nanoelectronics Research”
The aim of the NANOTEC project is to significantly enhance the reliability of RF-MEMS switches by using nanostructured materials (e.g. as dielectrics) as well as to demonstrate highly adaptive and miniaturised telecommunication and RF-sensing circuits, antenna front-ends and systems enabled
P2N group in FP7 NANOTEC project and download “Recommendations on Beyond CMOS Nanoelectronics Research”
The aim of the NANOTEC project is to significantly enhance the reliability of RF-MEMS switches by using nanostructured materials (e.g. as dielectrics) as well as to demonstrate highly adaptive and miniaturised telecommunication and RF-sensing circuits, antenna front-ends and systems enabled
Oral contribution at MNC 2012.
An oral contribution will be given by C. Simao at MNC 2012 concerning her work of self-assembly already in P2N group in ICN. Conference website: http://imnc.jp/general2012.html
Oral contribution at MNC 2012.
An oral contribution will be given by C. Simao at MNC 2012 concerning her work of self-assembly already in P2N group in ICN. Conference website: http://imnc.jp/general2012.html
Train2 Nanometrology workshop next week
3 and 4th of May, it will be held in UAB campus the TRAIN2 network nanometrology workshop. http://www.icn.cat/index.php/en/events/future-events/train2-workshop-on-nanometrology This is a two day intensive workshop which is pretty much worth attending. Try to if you’re around.
Train2 Nanometrology workshop next week
3 and 4th of May, it will be held in UAB campus the TRAIN2 network nanometrology workshop. http://www.icn.cat/index.php/en/events/future-events/train2-workshop-on-nanometrology This is a two day intensive workshop which is pretty much worth attending. Try to if you’re around.
Imec announces world-first 300mm-fab compatible directed self-assembly process line
http://www.electronics-eetimes.com/en/imec-announces-world-first-300mm-fab-compatible-directed-self-assembly-process-line.html?cmp_id=7&news_id=222911235 Imec’s announced in a press release a 28nm pitch features in PMMA resist in a full wafer via self-assembly. Impressive.
Imec announces world-first 300mm-fab compatible directed self-assembly process line
http://www.electronics-eetimes.com/en/imec-announces-world-first-300mm-fab-compatible-directed-self-assembly-process-line.html?cmp_id=7&news_id=222911235 Imec’s announced in a press release a 28nm pitch features in PMMA resist in a full wafer via self-assembly. Impressive.
Functional printing for smart surfaces 